# Diamond Foundry unveils 200 mm single‑crystal diamond wafer

> The lab‑grown diamond maker announced the first wafer‑size diamond that can be used to cool AI chips, a step toward larger‑scale semiconductor cooling.

Oossa · 2026-11-08 · https://oossa.com/en/diamond-foundry-unveils-200-mm-single-crystal-diamond-wafer

Diamond Foundry said it has produced a 200 mm single‑crystal diamond wafer, the same diameter used for older semiconductor processes. The company highlights that diamond conducts heat about five times better than copper, making it a strong candidate for cooling power‑hungry AI chips. The wafer is intended for use as a cooling material in semiconductor fabs.

## The facts

- 200 mm wafer size
- Diamond conducts heat at least five times the rate of copper

## Why it matters

If the wafers can be integrated into chip packages, AI hardware designers could manage heat more effectively, reducing the risk of overheating.

## Sources & references

1. [Diamond Foundry creates world's first 200mm single-crystal diamond wafer](https://www.tomshardware.com/pc-components/cooling/diamond-foundry-creates-worlds-first-200mm-single-crystal-diamond-wafer-massive-gem-aims-to-solve-ai-chip-cooling-crisis-envisioned-as-a-cooling-material-for-semiconductors) – Tom's Hardware, 2026-11-08

Last updated: 2026-11-08