# GlobalFoundries to make silicon interposers for TSMC's CoWoS in the US

> The two chipmakers signed a five‑year, $2 billion deal, with production starting in early 2028.

Oossa · 2026-10-08 · https://oossa.com/en/globalfoundries-to-make-silicon-interposers-for-tsmc-s-cowos-in-the-us

GlobalFoundries and TSMC have signed a five‑year agreement worth $2 billion. GlobalFoundries will produce silicon interposers – the tiny boards that connect chips – for TSMC’s CoWoS (chip‑on‑wafer‑on‑substrate) packaging. The deal creates a U.S. source for these parts, letting TSMC customers label their products as fully made and packaged in America. Volume production is planned to ramp up in the first half of 2028.

## The facts

- Five‑year agreement valued at $2 billion
- Volume production to begin H1 2028

## Why it matters

U.S. chip makers can source advanced packaging locally, reducing reliance on overseas suppliers.

## Sources & references

1. [GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion](https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion) – Tom's Hardware, 2026-10-08

Last updated: 2026-10-08