Diamond Foundry said it has produced a 200 mm single‑crystal diamond wafer, the same diameter used for older semiconductor processes. The company highlights that diamond conducts heat about five times better than copper, making it a strong candidate for cooling power‑hungry AI chips. The wafer is intended for use as a cooling material in semiconductor fabs.
Why it matters
If the wafers can be integrated into chip packages, AI hardware designers could manage heat more effectively, reducing the risk of overheating.
