GlobalFoundries and TSMC have signed a five‑year agreement worth $2 billion. GlobalFoundries will produce silicon interposers – the tiny boards that connect chips – for TSMC’s CoWoS (chip‑on‑wafer‑on‑substrate) packaging. The deal creates a U.S. source for these parts, letting TSMC customers label their products as fully made and packaged in America. Volume production is planned to ramp up in the first half of 2028.
Why it matters
U.S. chip makers can source advanced packaging locally, reducing reliance on overseas suppliers.
